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April 1998

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TechNet <[log in to unmask]>
Subject:
NI/AU plating thickness
From:
"Dave Pick -\"process engineer\"" <[log in to unmask]>
Date:
Thu, 23 Apr 1998 18:59:28 -0600
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"TechNet E-Mail Forum." <[log in to unmask]>, "Dave Pick -\"process engineer\"" <[log in to unmask]>
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TEXT/PLAIN (16 lines) 
After all the recent technet debate over nickel gold plating, I have a more
simple question. Is there a standard for nickel and gold plating thicknesses for
a SMT pad or PTH to be soldered; or at least a recommendation.

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