The Ni acts as a barrier layer to prevent the formation of CuAu intermetallics.
-----Original Message-----
From: Scott M. Severson [SMTP:[log in to unmask]]
Sent: Wednesday, April 22, 1998 9:47 AM
To: [log in to unmask]
Subject: [TN] Ni plating and Immersion Au
Why is nickel plating used with immersion gold processes when copper could
provide a solderable surface under the gold?
Thanks
Scott Severson
Benchmark Electronics Inc.
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################
################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe: SUBSCRIBE TechNet <your full name>
To unsubscribe: SIGNOFF TechNet
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################