I recently received immersion gold finished boards from a PCB supplier where
some of the edges of the traces were black. The gold was flaking or had a
bubbled appearance in areas as well.
I was told that the black was lead build-up from the plating bath since extra
lead was used to limit the reactivity of the bath. I was also told that if we
could live with the flaking, the lead build-up was not a reliability concern
as long as we had good solderability.
Is it likely that it is only lead and that reliability is not a problem?
Frank
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