Hi all,

I finally break my silence..(well except for a few mis-sent listserv
messages.... :)

I work with advanced packaging concepts and we are looking at taking
several Chip Scale
Packages (pkgs only approximately 20% larger than the bare die
themselves) and placing them
on a small prototype circuit board.  These CSP packages have 20-mil
pitch uBGA balls as I/O
and I'm curiously concerned about the ability to place these devices on
a circuit board with the
fine pitch. I was wondering if anyone could comment on any of their
experiences with CSP
packages, particularly from an I/O pitch, reliability or production (low
quantity) feasibility aspect.

Basically, I'm just looking for a better understand of what's been done
with CSPs, what
potential problems might be encountered in using them and what level of
PCB technology is
needed to accommodate these devices.

Thanks,
Bill

        William G. Brown
        MCMs & Electronic Packaging
        Sanders, A Lockheed Martin Co.
        PH (603) 885-3704  FX -7623
        =-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=
        Through the door of endless time
        We fall beyond the burning sky
        Like clouds that ever sink behind
        The crimson horizon's fading line

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