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March 1998

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Subject:
From:
Padmanabha Anandapuram Halappa <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 11 Mar 1998 07:54:37 EST
Content-Type:
text/plain
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text/plain (53 lines)
______________________________ Forward Header __________________________________
Subject: Grainy copper deposit.
Dear technet plating engineers,
I AM getting grainy copper deposit in my plating process,following is the
process parameters & details.please reply.



 -     additive ...copper gleam 125 T,LEA RONAL.4-5 ML/LTR
                 suggestion 7.5-10 ml/l
     copper sulfate...75-85g/l
     sulfuricacid...100-110ml/l
     chloride...50-60ppm.
     this problem started when we attempt to raise additive content
     from 5ml/l to 7.5ml/l.this problem appeared,one week after the
     addition of extra brightener.7.5 ltr brightener added at a time
     to 4 copper tanks of 3000 ltr each.(7.5ltr/tank.).
     IN the beginning we suspeccted organic contamination,& anode sludge.
     carbon treatment done,anode baskets cleaned.
     again we try maintain additive at 7.5ml/l as per vendor suggestion.
     cvs used to analyse addditive content.
     after one week GRAINY COPPER reappeared on the panels,since hard
     deburring did not help & have to scrap beacause of cosmetic.
     Since 125 T is one component (pre mixed leveller,brightener,&carrier)
     vendor did not help on analysing it seperatly.
     This grainy copper repeated atlest 5 times,eventhough sometime no
     addition (additive) made.
     since vendor did not help much on this ,I used stop addition of
     brightener ,atlest 2 shift,to stop this problem.vendor reply is
     our predip acid copper is high.
     this grainy copper most of the time on highcurrent area.
     The current density in use 1.5 to 2.1
     the panels with 1.8to 2.1 ASD normally get this problem.
     anode balls of 1" dia are being used.
     thanks & expecting a Positive reply to understand 125T.
     padmanabha.A,H.



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