1)  Have you assembled one of these boards using your
typical processes and then microsectioned the holes????

2)  This would tell you if the barrels crack with first soldering.

3)  Have you determined what environment the system will
see during use?  This will determine thermal excursions the
actual assembly will see with power dissapation to see what
CTE you might have during use.

4) If the plating is not good enough to withstand the zaxis expansion
then you can plate 10 mils and it won't do any good

Susan Mansilla
Robisan Lab

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