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March 1998

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Subject:
Re: Assembly - Component Mounting
From:
Matthew Park <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 10 Mar 1998 12:53:10 -0800
Content-Type:
text/plain
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text/plain (55 lines) 
Jack,

Do you actually measure the spacing req's  or do you do an
eyeballing est?  I always thought IPC spec's are common
guidelines that most mfg's agreed to follow.  Depending upon an
application, 0.5mm spacing or less is perfectly OK for heat
disspation.  You have to know why a particular guideline is there
and what it trys to achieve.  Thanks for pointing out the conflict.
Maybe IPC can clarify this issue or make a necessary change for
next rev.

Matthew
NII Norsat International Inc.


>>> Jack Bryant <[log in to unmask]> March 10, 1998  3:33 pm
>>>
Dear Sirs:
With reference to IPC-A-610, rev B, components that dissipate 1
watt or
greater must be mounted 1.5 mm above the board surface.
(section 3.2.1,
page 31) Why does IPC-CM-770 rev D state these components
must be
mounted only .5 mm from the board surface? (section 5.2.4.2,
page 2-3.)
Why the conflict in Standards?

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