Yes, that is correct.  Refer to table 4-1, 2nd row "Vertical fill of solder" lists
75% fill minimum for Class 2 and 3.  Row 1 "Circumferential wetting - primary side -
lead and barrel" is the definitive factor; 180 degrees is required for class 2, 270
degrees is required for class 3.  You difficulty will be in viewing the space between
the lead and the barrel to ascertain the minimum wetting. Jack

Jack Crawford, IPC Project Manger - Assembly
2215 Sanders Road, Northbrook IL  60062-6135
[log in to unmask]        http://www.ipc.org
847-509-9700 x 393
fax 847-509-9798

>>> "Gustafson, Steve @ CLW" <[log in to unmask]> 03/10/98 05:52AM >>>
We are currently have a problem with a customer on the requirement
interpretation of section 4.1 of ANSI/IPC-A-610, revision B(for class 2
and 3).  With respect to the vertical fill of solder, is it acceptable
for the solder to not reach the top edge(entire 360 degrees) of the
plated through hole on the primary side of the assembly, as long as the
wetting requirements are met?

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