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March 1998

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Subject:
URGENT!!!!!! Residues after Reflow
From:
Ruben Irizarry <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 10 Mar 1998 14:22:31 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines) 
Hi everybody,
Can someone help me with the following:
I am having problems with the solder quality after passing MST components
by Forced Convection Ovens. The pads are gold platted and the solder is
Delta Qualitek No Clean 63 37. The fillets are ok, the wetting is there but
there are some yellow residues in top of the solder joints. What is the
root cause?? Could it be Flux residues??? Or reaction between Solder paste
and GOLD?? Or what??

Please help me out this is very important.

Ruben E. Irizarry
Operations Engineer

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