The min resistivity value for Si wafers is 12 .


ashok

> ----------
> From:         Mike Masters[SMTP:[log in to unmask]]
> Sent:         March 9, 1998 9:06 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Wafter Diceing Water Req.
>
> Hi David,
>
> I can't tell you the actual specifications, but we use 17 Meg. DI for
> dicing operations.  I have
> seen it drop to as low as 15 Meg. DI.  This is wafer on the expand
> sheet.
>
> Hope this helps,
>
> Mike
>
> David D Hillman wrote:
>
> > Hi TechNet - I am looking for info/opinions/etc. to the following
> question:
> >
> > What level of resistivity (e.g. 2 Megohm,or 18 Megohm) of water do
> you
> > suggest using or have had success using for wafer sawing operations
> for
> > both silicon and GaAs materials?
> >
> > Dave Hillman
> > Rockwell Collins
> > [log in to unmask]
> >
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