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March 1998

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Subject:
From:
"Desroches, Charles" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 10 Mar 1998 09:19:41 -0500
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text/plain (78 lines)
Hello Ji,

We have been experiencing the same situation in our facility. The
process we used was Shipley 5700B micro-etch which is basically a H2SO4
/ H2O2 combined with a stabilizer system (5700B).

This is a normal degradation of the stabilizer that occurs with time and
total workload. We resolved this problem by installing a filtering unit
on this bath. 1.5 turnover/hour is sufficient to remove the residue.

Have you considered persulfate instead of sulphuric/peroxide. You would
most likely eliminate the resisdue problem and enjoy a better surface
topography.

Regards,

Charles Desroches
Technical Advisor
Viasystems Canada inc. (Granby)
Voice: (514) 372-8111 ext: 2257
Fax:    (514) 3788-5110



> ----------
> From:         [log in to unmask][SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;[log in to unmask]
> Sent:         Monday, March 09, 1998 9:33 PM
> To:   [log in to unmask]
> Subject:      [TN] Organic residue in Microetch bath
>
> I need help to minimize organic contamination occuring in Microecth
> bath in
> pattern plating bath. The contamination is a brown, gummy material.
> When the
> solution is nearly to be discarded, the contamination occurs and
> floats in the
> surface of the bath. If the solution is not restarted, black spots on
> the
> surface of copper can be seen in inspection and will cause open
> circuit in
> etching process without correct action.
> Our microecth bath is made up of H2SO4&H2O2, using 746W(SHIPLEY
> CHEMICALS) as
> stabilizer. No filter pump is employed in this bath.
> Can anyone offer suggestions the eliminate this residue?
> Thanks in advance.
>
> Ji Jiancheng
>
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