I need help to minimize organic contamination occuring in Microecth bath in
pattern plating bath. The contamination is a brown, gummy material. When the
solution is nearly to be discarded, the contamination occurs and floats in the
surface of the bath. If the solution is not restarted, black spots on the
surface of copper can be seen in inspection and will cause open circuit in
etching process without correct action.
Our microecth bath is made up of H2SO4&H2O2, using 746W(SHIPLEY CHEMICALS) as
stabilizer. No filter pump is employed in this bath.
Can anyone offer suggestions the eliminate this residue?
Thanks in advance.

Ji Jiancheng

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