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March 1998

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Subject:
Re: Haloing Measurement
From:
Ron Payne <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 2 Mar 1998 09:10:52 -0800
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You can use IPC-6012 criteria or develop your own. I use 50% max or 0.031
for FR4 or 0.050 for polyimide. One measures from the board edge in to the
nearest circuit pattern. It applies to bd edges, slots, cutouts and
non-plated holes.

The board edge spacing has to be designed properly to avoid rejections.



>How is one to measure haloing to determine if it meets criteria of
>para. A.3.5.1.3 of MIL-PRF-55110?
>
>Regards,
>Rob Carrillo
>
>[log in to unmask]
>
>
><!DOCTYPE HTML PUBLIC "-//W3C//DTD W3 HTML//EN">
><HTML>
><HEAD>
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><META content=text/html;charset=iso-8859-1 http-equiv=Content-Type>
><META content='"MSHTML 4.71.1712.3"' name=GENERATOR>
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><DIV><FONT color=#000000 size=2>How is one to measure haloing to determine
if it
>meets criteria of</FONT></DIV>
><DIV><FONT color=#000000 size=2>para. A.3.5.1.3 of MIL-PRF-55110?</FONT></DIV>
><DIV><FONT color=#000000 size=2></FONT>&nbsp;</DIV>
><DIV><FONT color=#000000 size=2>Regards,</FONT></DIV>
><DIV><FONT color=#000000 size=2></FONT><FONT size=2>Rob Carrillo</FONT></DIV>
><DIV><FONT size=2></FONT>&nbsp;</DIV>
><DIV><FONT size=2><A
>href="mailto:[log in to unmask]">[log in to unmask]</A></FONT></DIV>
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