Hello,

Searching for feedback on the requirements for ICT testing.

a.) Do the vias need to be filled with solder?
b.) Do the probes need to make contact with the center of the via
or should the probe contact the via pad only?

I have a customer who is requiring the solder side vias be filled
with solder and the component side vias plugged with mask. I've
explained that via plugging with mask is not an issue, but I can not
guarantee 100% solder filled vias after HASL. The customer is telling
me their ICT test fixture needs to probe the center of the via.
(10 layer board / double sided SMT's)

What is your experience and advice?

Michael Dodson

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