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March 1998

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Subject:
Re: Wafter Diceing Water Req.
From:
Mike Masters <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 9 Mar 1998 10:06:45 -0500
Content-Type:
text/plain
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text/plain (57 lines) 
Hi David,

I can't tell you the actual specifications, but we use 17 Meg. DI for dicing operations.  I have
seen it drop to as low as 15 Meg. DI.  This is wafer on the expand sheet.

Hope this helps,

Mike

David D Hillman wrote:

> Hi TechNet - I am looking for info/opinions/etc. to the following question:
>
> What level of resistivity (e.g. 2 Megohm,or 18 Megohm) of water do you
> suggest using or have had success using for wafer sawing operations for
> both silicon and GaAs materials?
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
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Mike Masters
QA Materials Engineering Section
Office: (919) 479-3771
FAX:    (919) 479-3328
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