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March 1998

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Subject:
Wafter Diceing Water Req.
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 9 Mar 1998 08:24:45 -0600
Content-Type:
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Hi TechNet - I am looking for info/opinions/etc. to the following question:

What level of resistivity (e.g. 2 Megohm,or 18 Megohm) of water do you
suggest using or have had success using for wafer sawing operations for
both silicon and GaAs materials?

Dave Hillman
Rockwell Collins
[log in to unmask]

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