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March 1998

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Subject:
From:
David D Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 9 Mar 1998 07:39:28 -0600
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Hi TechNet - a DARPA funded demonstration project will be having a
"Industry Day" on March 26 & March 27 at the EMPF in Indianapolis IN. A
small consortia team (Rockwell Collins, Nortel, CSL Inc., Rockwell Science
Center, SEHO USA, Allen Bradley, EMPF/ACI) has concluded its efforts on
demonstrating solderability restoration (Reduced Oxide Soldering Activation
- ROSA) on a variety of technologies (flip chip, printed wiring boards,
components) and in a specific set of tasks (benchtop/full size modules
construction/design, process compatibility, environmental issues, etc.).
ROSA is a electrochemical method of restoring solderability to solderable
surfaces in a closed loop, environmentally benign process. The Industry Day
program will include presentations detailing the 16 month DARPA funded
program, solderability restoration demonstrations of both benchtop and
in-line ROSA restoration modules for components and printed wiring boards,
and an opportunities for attendees to complete restoration of their
components/boards. This Industry Day is designed to disseminate the DARPA
solderability restoration demonstration efforts to the electronics industry
and is open to everyone/anyone interested. For additional information you
can contact myself (see below) or the EMPF registration desk at
317-655-3679.

I  had this announcement approved through IPC (Dave Bergman) prior to
posting so please keep the soot levels to a minimum (and I apologize in
advance if this appears to be a commercial - my intent is to disseminate
information that our consortia team has completed).


Dave Hillman
Rockwell Collins
[log in to unmask]

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