TECHNET Archives

March 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Josh Moody <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 2 Mar 1998 10:21:07 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (31 lines)
Technetters,

I was wodering if anyone out there is currently using Palladium
as a surface finish. I am primarily interested in eless Ni/Pd/ Imm Au.
I know that Atotech and LeaRonal both offer this chemistry, but who
is using (i.e. end users).  What applications are they using it for
(i.e. wirebond, solder attach, socket attach of ASICs) Have any assembly
problems been identified?

Thanks in advance.



Josh Moody
Materials Quality Engineer
Hewlett-Packard - Richardson (HPSD)
ph# (972) 497-4617
[log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################


ATOM RSS1 RSS2