I don't have a definitive answer, but I know that in the last few
     years there has been a movement in the defense industry towards
     Commercial Off The Shelf (COTS), which implies using plastic packages
     where hermetic packages have traditionally been used.  Mike Pecht at
     the University of Maryland has been doing work in this area, so I
     would recommend a lit search on him as well as on COTS.

     Hope this helps,
     Rod Martens
     Hewlett-Packard


______________________________ Reply Separator _________________________________
Subject: [TN] Reliability of Ceramic vs. Plastic IC Packages
Author:  Non-HP-seder ([log in to unmask]) at HP-ColSprings,mimegw4
Date:    3/6/98 1:08 PM


I would like to know if there is a definitive work that compares the performance
 of plastic IC packaging vs. Ceramic IC's. I have recently transitioned from the
 commercial world (automotive electronics) where plastic packaging is prevalent
to the defense industry, where ceramic packaging has been used almost exclusivel
y for years. We currently have a contractual opening on a project to use plastic
 parts, but we would like to make an informed decision. The temperature range of
 the assembly is -40 C to 75 C, which compares well to my experience in the auto
motive world.

Hopefully this issue has come up in the past and someone could help me out on th
is subject.  I would like some back-up material that would help my case that pla
stic packaging has evolved to the point where reliability is as good as ceramic
packaging.


Thanks!

Scott Eder
Tracor Manufacturing Engineering
215 996 2517

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