I would like to know if there is a definitive work that compares the performance of plastic IC packaging vs. Ceramic IC's. I have recently transitioned from the commercial world (automotive electronics) where plastic packaging is prevalent to the defense industry, where ceramic packaging has been used almost exclusively for years. We currently have a contractual opening on a project to use plastic parts, but we would like to make an informed decision. The temperature range of the assembly is -40 C to 75 C, which compares well to my experience in the automotive world. 

Hopefully this issue has come up in the past and someone could help me out on this subject.  I would like some back-up material that would help my case that plastic packaging has evolved to the point where reliability is as good as ceramic packaging. 

 
Thanks!

Scott Eder
Tracor Manufacturing Engineering
215 996 2517

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