Hey Ji -

sounds like u r getting a porous deposit in some areas and the resist stripper
and eventually the etching solution is breaking down the solder barrier.

Plutin La - if u don't use this process for reflowing boards and don't care
about solder composition when plating - make sure you have the minimal spec on
tin and lead - think they talk about 3.2 oz/gal tin and 1.88 oz/gal lead - try
bringing fluoborate acid up to a minimum of 15 oz/gal - make sure you have
enough grain refiner in solution - and make sure you do not have a deficiency
in make-up solution. Also have u been adding - i think they ask for 1lb per
gallon of conductivity salts - for every time u make an addition of fluoboric
- if not - your free fluoboric will eventually break down to boric and
hydrofluoric - this will cause a white haze to be seen in areas of the board.

Sounds like a little hull cell work in the lab and u will be back in business
- just sounds like the process is in a deficient state.


regards

Rick Fudalewski

Atotech Canada Ltd

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