Tom,

Just some added comments.

You might consider working with the design dept to make sure you get
some test pads on the board so you can reduce the number of component
pads you are wanting to connect to. Also, there are many style test
probes out there. We use the style that is specifically designed as a
flux penetrator and remover. The theory there being that the probe
penetrates the flux and is designed with such a steep slope that any
residue that is penetrated 'flows' off the tip and eventually flows off
the head of the probe.

Hope this helps a little for you!

Richard Hamilton
Clemar Mfg. / Rain Bird
[log in to unmask]

> -----Original Message-----
> From: Simonson, Tom (MN51) [SMTP:[log in to unmask]]
> Sent: Tuesday, March 31, 1998 9:42 AM
> To:   [log in to unmask]
> Subject:      [TN] Incircuit testing low residue cca's
>
> We have recently switch over to a low residue soldering process.  We
> have plated thru-hole, smt and mixed technology cca's in our factory
> with relatively dense packaging.  So far to date our process has been
> performing very well with one exception, incircuit test.  At ICT we
> are
> having basically one problem and that being, probing  through areas
> that
> have had add on components and/or touchup.  These area's are soldered
> with a low residue flux (rma type) 2.2% flux, which we are looking at
> reducing to 1.1%.  At ICT we are running predominately vacuum with no
> top side clamping.  Insertion forces range between 8 and 11 oz and we
> use steel probes in addition we index the ICT fixture multiple times
> to
> make proper contact.  My question is, what are other companies doing
> to
> overcome this problem?  Are you spot cleaning? Is there something
> special you are doing at ICT to overcome this problem?  Is there any
> cored flux out there that can be probe after extended periods of time?
> Thanks in advance.
>
> Tom Simonson
>
> ################################################################
> TechNet E-Mail Forum provided as a free service by IPC using LISTSERV
> 1.8c
> ################################################################
> To subscribe/unsubscribe, send a message to [log in to unmask] with
> following text in the body:
> To subscribe:   SUBSCRIBE TechNet <your full name>
> To unsubscribe:   SIGNOFF TechNet
> ################################################################
> Please visit IPC web site (http://jefry.ipc.org/forum.htm) for
> additional information.
> For the technical support contact Dmitriy Sklyar at [log in to unmask] or
> 847-509-9700 ext.311
> ################################################################

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################