We have recently switch over to a low residue soldering process.  We
have plated thru-hole, smt and mixed technology cca's in our factory
with relatively dense packaging.  So far to date our process has been
performing very well with one exception, incircuit test.  At ICT we are
having basically one problem and that being, probing  through areas that
have had add on components and/or touchup.  These area's are soldered
with a low residue flux (rma type) 2.2% flux, which we are looking at
reducing to 1.1%.  At ICT we are running predominately vacuum with no
top side clamping.  Insertion forces range between 8 and 11 oz and we
use steel probes in addition we index the ICT fixture multiple times to
make proper contact.  My question is, what are other companies doing to
overcome this problem?  Are you spot cleaning? Is there something
special you are doing at ICT to overcome this problem?  Is there any
cored flux out there that can be probe after extended periods of time?
Thanks in advance.

Tom Simonson

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