Hi Joe,
I do not know what 'manufacturability data' you are looking for; they only
real difference from a manufacturing point of view would be the possible
different thermal masses of CBGAs vs PBCAs. That may result in different
profiling needs during reflow (depending on reflow machines, of course).
A more important question to ask would be about the reliability of the solder
joints of CBGA vs PBCA on an FR-4 PCB. The much larger CTE-mismatch of CBGAs
with FR-4 is likely (depending on the application, of course) giving you a
much reduced reliability, everything else being equal.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask]

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