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March 1998

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Subject:
Grainy copper deposit. -Reply
From:
Fred Johnson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 5 Mar 1998 19:18:52 +0000
Content-Type:
text/plain
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text/plain (32 lines) 
WE NEED MORE INFORMATION!  Are the traces in low-density areas, with
other areas of high density not exhibiting the problem?  Are the problems
due to nodules or spikes, or are they low-current or high-current
burning?  Is this problem only on circuits?-what about in the holes or on
the pads?
WE NEED MORE INFORMATION!

Fred J.

>>> Padmanabha Anandapuram Halappa <[log in to unmask]>
03/05/98 01:19pm >>>
     dear technet plating engineers,
     need to know how to overcome grainy copper deposit & dendrite
copper
     growth in acid copper plating.Dendrite grows at track edge & shorts
     with neighbouring track.
     Does acid dip before copper plating with copper contamination about
     100 ppm can cause this.
     thanks.

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