TECHNET Archives

March 1998

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Roel A. Robles" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 31 Mar 1998 11:14:44 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines)
Good Day,

Does anybody have any information where i can get reference materials
regarding Tape Automated Bonding. So far, the references that we have
are general descriptions and TAB manufacturing. What i need are info
about assembly using this package (equipment, materials etc).

Any info would be appreciated

Regards

Roel Robles

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################


ATOM RSS1 RSS2