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March 1998

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Subject:
From:
Don Vischulis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 29 Mar 1998 19:19:11 -0600
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Craig:

Check the Technet archives for previous discussions on the use of electrolytic tin as a final
finish.  If memory serves, some work was done to inhibit the growth of tin whiskers through
incorporating controlled amounts of impurities to codeposit with the tin.  Beyond the whisker
issue, plating slivers from fracture of tin overhang caused by etching is another concern.  Some
have attempted to reflow tin, but given the higher melting point what is being gained over
tin/lead alloy?

Don Vischulis

craig sutton wrote:

> ONE CUSTOMER RECENTLY STARTED SPECIFYING 100-300 MICROINCHES OF
> ELECTROPLATED TIN AS A SURFACE FINISH ON SOME NEW PRODUCTION REQUIREMENTS.
> WE DO NOT HAVE THIS PROCESS IN-HOUSE BUT IT CAN BE EASILY INSTALLED.
>
> I HAVE NOT SEEN THIS FINISH ON OTHER SPECIFICATIONS IN THE PAST.  IS THIS A
> VIABLE CHOICE?  ARE THERE ANY PROBLEMS ASSOCIATED WITH PERFORMANCE AT HIGH
> FREQUENCY (6-15 GHZ)?  DOES THIS FINISH EXHIBIT DENDRITE GROWTH?  UNDER
> WHAT CONDITIONS?
>
> THANK YOU FOR YOUR HELP.

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