In response to the recent messages posted about palladium plated leads,
it would be interesting to hear what specific problems the authors have
experienced with palladium plated components rather than generalizations
that the technology simply "doesn't work". Although I do not propose to
speak for TI, the fact that they have more than 20 billion Pd plated
components in the field speaks volumes for its functionality and acceptance.
Most board assembly shops are attaching palladium plated components to their
boards right now although they may not even know it.
Other than TI, a number of other large companies have converted or
intend to convert certain product lines to palladium, although the recent
price increases of Pd may slow their initially optimistic conversion
programs.
Palladium functions as a sacrificial coating which protects the
underlying base material or coating from oxidation. Palladium dissolves in
the solder paste during reflow, and all soldering takes place to the
underlying coating, NOT to the Pd. Therefore, palladium does not need to be
a solderable coating, it only needs to be a protective coating. Palladium
is seeing increased acceptance as both a wire bondable finish and for
preservation of solderability, not only on components but also on circuit
boards.
Agreed that palladium will not work in all applications, and there
certainly are issues with the technology which individual companies as well
as the NiPd Focus Group, an informal consortium formed to promote the
technology, hope to address.
Rob Schetty
LeaRonal Inc.
Freeport, NY USA
-----Original Message-----
From: Furrow, Robert Gordon (Robert) <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Friday, March 27, 1998 8:35 AM
Subject: Re: [TN] Parts Solderability (2)
>I agree that palladium is not the finish of choice. I suggest that
>others with this position voice their opinion directly to TI using the
>link Eddie Brunker has imbedded. Go to Feedback, then to SemiConductors,
>on to Americas (for those on this side of the Atlantic), and finally to
>EMail. The concerns of one customer is easily forgotten, but maybe a lot
>of responses all to the same email address will make our opinion heard.
>This of course is my own opinion and does not necessarily reflect those
>of my company.
>Thanks,
>Robert Furrow
>
>>----------
>>From: Eddie Brunker[SMTP:[log in to unmask]]
>>Reply To: "TechNet E-Mail Forum." <[log in to unmask]>,Eddie Brunker
>>Sent: Friday, March 27, 1998 5:50 AM
>>To: [log in to unmask]
>>Subject: [TN] Parts Solderability (2)
>>
>>Hi,
>>
>>What about the solderability of Palladium finished leads on TI devices.
I'm
>>surprised this subject hasn't been discussed on this list! TI are
determined
>>to continue with their lead free technology in spite of the fact that it
>>doesn't work. Palladium just isn't a highly solderable finish. In spite of
>>numerous companies finding problems with these devices, it fails to get
>>discussed! There is a white paper on a TI web site which proclaims the
>>virtues of this finish. It would make a very interesting basis for a
thread
>>of discussion. http://www.ti.com/sc/docs/asl/palladm
>>
>>Regards,
>>
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