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March 1998

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Subject:
From:
"Furrow, Robert Gordon (Robert)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 27 Mar 1998 08:24:04 -0500
Content-Type:
text/plain
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text/plain (60 lines)
I agree that palladium is not the finish of choice. I suggest that
others with this position voice their opinion directly to TI using the
link Eddie Brunker has imbedded. Go to Feedback, then to SemiConductors,
on to Americas (for those on this side of the Atlantic), and finally to
EMail. The concerns of one customer is easily forgotten, but maybe a lot
of responses all to the same email address will make our opinion heard.
This of course is my own opinion and does not necessarily reflect those
of my company.
Thanks,
Robert Furrow

>----------
>From:  Eddie Brunker[SMTP:[log in to unmask]]
>Reply To:      "TechNet E-Mail Forum." <[log in to unmask]>,Eddie Brunker
>Sent:  Friday, March 27, 1998 5:50 AM
>To:    [log in to unmask]
>Subject:       [TN] Parts Solderability (2)
>
>Hi,
>
>What about the solderability of Palladium finished leads on TI devices. I'm
>surprised this subject hasn't been discussed on this list! TI are determined
>to continue with their lead free technology in spite of the fact that it
>doesn't work. Palladium just isn't a highly solderable finish. In spite of
>numerous companies finding problems with these devices, it fails to get
>discussed! There is a white paper on a TI web site which proclaims the
>virtues of this finish. It would make a very interesting basis for a thread
>of discussion. http://www.ti.com/sc/docs/asl/palladm
>
>Regards,
>
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