I would like to know if there is any technical literature that talks about
the difference in the reliability of a single sided no plated through hole
solder joints compared to a double sided plated through hole.

I really will appreciate if you can indicate to me any technical reference
that describes such comparison between these to solder joint geometry, and
specifies parameters such as strength, life time of the joint, etc.

Actually,  more than a plated through hole,  I am taking about what could be
called a "plated through slot" versus a single sided no plated through slot,
making the solder joint with a "metal wrap" or what could be considered a
metal piece surrounding an RF circuitry.

Guillermo Gonzalez
Product Assurance Process Capablity Mgr.
Thomson Consumer Electronics
[log in to unmask]

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For the technical support contact Dmitriy Sklyar at [log in to unmask] or 847-509-9700 ext.311
################################################################