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March 1998

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Subject:
Re: copper etching
From:
Paul Gould <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 25 Mar 1998 19:39:54 -0000
Content-Type:
text/plain
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text/plain (22 lines) 
Hi Fred,

How about using a solution of sodium persulfate or ammonium persulfate. The
etch rate is slow at around 25 minutes to remove 1 mil but it is consistent
provided the copper surface is clean. If you agitate the panel it will tend
to etch more around the panel edges so it may be better to just immerse in
the etch.

You can determine etch rate by weight loss over time.

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