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March 1998

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Subject:
Re: Plating thin, less than .005", via layers
From:
"Eltek Ltd. - Process Engineering" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 26 Mar 1998 09:24:26 +0300
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines) 
At 10:21 25/03/98 -0700, you wrote:
>I regularly need to clamp via layers (PWB's) to unclad fiberboard frames
>before pattern plating. We currenty use platers' tape to attach the via
>to the frame, it works well but it's too time consuming. Does anyone
>have a better way to do this? Is there a clamping device out there?
>Will appreciate any sugestions.
>                                    Henry Coulter
>
Henry !
If someone will send You answer directly ( off - technet ) pls  forward it
to me also .
Edward Szpruch
Eltek Ltd - Israel
Tel  972 3 9395050
Fax 972 3 9309581
E-mail :  [log in to unmask]

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