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March 1998

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Subject:
From:
"Leslie O. Connally" <[log in to unmask]>
Reply To:
Leslie O. Connally
Date:
Wed, 25 Mar 1998 10:52:07 -0800
Content-Type:
text/plain
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text/plain (43 lines)
Jim,
 I agree with one exception, If we are talking about the same number of holes,
the larger holes will yield the greater cross sectional area. If more small
holes are placed on a smaller grid, then the greater area can be accomodated.

Cheers,
Les Connally

>  From: Jim Marsico 516-595-5879 <[log in to unmask]>, on 3/25/98 10:13 AM:
>  Whichever yields the most cross sectional area of copper will give you the
>  best
>  thermal performance, therefore, more small holes would be the best scenario.
>  We, in fact require vias to be plated with .002" of copper for thermal
>  reasons.
>
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