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March 1998

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Subject:
Re: Thermal Vias
From:
Jim Marsico 516-595-5879 <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 25 Mar 1998 10:13:00 -0400
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (16 lines) 
Whichever yields the most cross sectional area of copper will give you the best
thermal performance, therefore, more small holes would be the best scenario.
We, in fact require vias to be plated with .002" of copper for thermal reasons.

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