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March 1998

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Subject:
From:
SteveZeva <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 24 Mar 1998 17:54:10 EST
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Brad,

     I had the same problem with some SO16's when I was down on the TAC line
at NEPCON this year. We were building the double-sided PCMCIA card in the flip
line that was set-up there. I was using a Zevatech 740, usually we have no
problems at all with reeled parts. But there was one reel of SO16's that was
given to me, that I finally took off the machine it was giving me so many
problems. I had two reels set-up so I could double-pick the parts, but I gave
one reel back to Ray Rua and just picked the SO16's just using one head
instead of two...

     I just got off the phone with a gentleman from Advanced Packaging
Technologies here in San Jose (they make carrier tape, cover tape, reels,
etc.) and I asked him about cover tape and some of the problems you and I are
seeing. He said that there isn't any tape nowadays that doesn't have adhesive
on it. Mostly there's two types, tapes that use pressure sensitive adhesive,
and tapes that use heat activated adhesives...the latter is the most common
type used.

     I asked him if it was possible for the peel-back force to increase from
what it was when the components were first tape and reeled, and he said
absolutely! It would depend on how the components were stored...inside a box
in some stockrooms it can get pretty hot, and I can think of a thousand other
places where it could get a tad "toasty". Like in the back of a UPS truck
driving around Phoenix in the middle of summer, or sitting the reel on top of
the reflow oven while you're waiting for the feeder on the machine to run out,
etc., etc...

                        I learned something today because of your
post...thanks Brad!!

                                                                         -Stev
e Gregory-

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