Hi Gareth,

we have such a system for evaluation project. But actually no results because it is just
installed.
We know that the bump height must have a very small tolerance window and the interface of
polyimide to copper needs a absorption dark layer to have a hight laser enegry absorption.
This system is patented by PacTec and I do not know other system suppliers.

Regards
Achim

Hello Everyone,

> I've recently read an article by PAC TECH on Laser solder ball
> bumping of chips and substrates. This article provides information on the
> basics of the process and the advantages of using this system.
> However this article does not give draw backs to the technology and
> also does not fully explain away some of the technical difficulties
> one might expect from using such a technology.
>
> Such as the advantage of finer pitch if you bump the chip, and yet the substrate still
> requires a solder paste deposit, therefore losing the
> advantage unless you bump both
>
> Does anybody know of other companies which boast laser solder ball
> technologies or have experience with this.
>
> Thanks very much
>
> Gareth
>
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