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March 1998

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Subject:
From:
James A Larson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 24 Mar 1998 13:00:44 +0000
Content-Type:
text/plain
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text/plain (34 lines)
We currently have a board requirement for a 7 layer board.

The design limits the modification to make it a balanced
even numbered layup and to rearrange thicknesses.

The cores are

single sided cap with 3/8 oz. CU.
.0039 core

followed by
.016  core  3/8 /  3/8 CU
.016  core  3/8 /  3/8 CU
.016  core  3/8 /  3/8 CU

Question:  Does anybody have any ideas to help reduce the
warpage that will occur on this type of layup?

ROR,  Lagging,  Cool Rates, etc.....

                                                                         thanks

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