Hello all;
I would be interested in hearing any comments about etching down 1oz.
copper foil to 1/4 oz or 3/8 oz.  It is our understanding that this requires a
specific equipment set to control the uniformity of the thickness across
the panel surface; it is also our understanding that chemical control is
very important (although I am not sure what types of chemistry may used
for this process, i.e. cupric, sulfuric/peroxide, etc.).

Any suggestions for equipment and chemistries would be appreciated.

Regards,
Fred Johnson
JMSPI

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