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March 1998

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Subject:
From:
"Lepsche, Thomas G (NM75)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 23 Mar 1998 11:04:59 -0700
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Ed,
        As your straight man.............Given the proper reflow profile, In my
humble experience all solder present reflows. (But then we use vapor
phase)
Semper Fi
Tom

>----------
>From:  Ed Cosper[SMTP:[log in to unmask]]
>Sent:  Monday, March 23, 1998 10:40 AM
>To:    [log in to unmask]
>Subject:       Re: [TN] Assembly - Solder reflow
>
>Perhaps someone could enlighten me on this issue.  When the printed circuit
>board has the solder paste applied to the smt pads, the smt component placed,
>and then processed thru a convectional ( or IR) reflow oven, does the
>original solder from the Hot Air level process actually melt and reflow with
>the solder paste or does the topography of the original solder remain the
>same?
>
>
>Ed Cosper
>GEI Circuits, Inc.
>
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