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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 23 Mar 1998 11:04:59 -0700 |
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Ed,
As your straight man.............Given the proper reflow profile, In my
humble experience all solder present reflows. (But then we use vapor
phase)
Semper Fi
Tom
>----------
>From: Ed Cosper[SMTP:[log in to unmask]]
>Sent: Monday, March 23, 1998 10:40 AM
>To: [log in to unmask]
>Subject: Re: [TN] Assembly - Solder reflow
>
>Perhaps someone could enlighten me on this issue. When the printed circuit
>board has the solder paste applied to the smt pads, the smt component placed,
>and then processed thru a convectional ( or IR) reflow oven, does the
>original solder from the Hot Air level process actually melt and reflow with
>the solder paste or does the topography of the original solder remain the
>same?
>
>
>Ed Cosper
>GEI Circuits, Inc.
>
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