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March 1998

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Subject:
Re: Assembly - Solder reflow
From:
Ed Cosper <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 23 Mar 1998 11:40:45 -0600
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Perhaps someone could enlighten me on this issue.  When the printed circuit board has the solder paste applied to the smt pads, the smt component placed, and then processed thru a convectional ( or IR) reflow oven, does the original solder from the Hot Air level process actually melt and reflow with the solder paste or does the topography of the original solder remain the same? 


Ed Cosper
GEI Circuits, Inc.

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