The gold flash spec is usually from your vendors capability. However
     as noted in a report published in the proceedings from the IPC Summit
     on Surface Finishes and Solderability, Sep. 97, For solderability
     reasons the minimum should never go below 3 microinch. Each
     application should be tested independently to make sure this is an
     adequate thickness for whatever application it is going into. The
     thinner the gold the easier it is wiped off and in addition the more
     pores it will have making it more susceptible to oxidation of the
     nickel barrier under the gold.  Flash gold pores are not specified
     they are there and there are usually too many to count. Once again
     check with your supplier on expected hardness and gold purity of the
     plating.

     Regards:

     Steve O'Hara  HP


______________________________ Reply Separator _________________________________
Subject: Re: [TN] : FAB: Flash Gold
Author:  Non-HP-MYuen ([log in to unmask]) at HP-Vancouver,uugw10
Date:    3/23/98 6:13 AM


IPC-D-275 Section 3.8.4.3.

Hope that helps
Michael Yuen
 ----------
From: Poh Kong Hui
To: [log in to unmask]
Subject: Re: [TN] : FAB: Flash Gold
Date: Monday, March 23, 1998 8:45AM

Hi Technetters,

Could someone can advise me on what standard (such as IPC) to use for the
requirement of Gold flash PCB, such as gold min/max thickness, surface
porosity, hardness, and etc.


Thks in Advance.

Poh

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