Hello Everyone,

I've recently read an article by PAC TECH on Laser solder ball
bumping of chips and substrates. This article provides information on the
basics of the process and the advantages of using this system.
However this article does not give draw backs to the technology and
also does not fully explain away some of the technical difficulties
one might expect from using such a technology.

Such as the advantage of finer pitch if you bump the chip, and yet the substrate still
requires a solder paste deposit, therefore losing the
advantage unless you bump both

Does anybody know of other companies which boast laser solder ball
technologies or have experience with this.

Thanks very much

Gareth

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