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March 1998

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Subject:
From:
"Dave Pick -\"process engineer\"" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 23 Mar 1998 09:38:11 -0600
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (18 lines)
I have read somewhere of a component weight to SMT lead contact area ratio rule
for double sided reflow. This ratio would be the maximum component weight to SMT
pad contact area that would allow surface tension to overcome gravity. If the
weight to surface area ratio is over this number, the part would fall off. Does
anyone know what this ratio is?

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