I am currently trying to design solder masking pallets to eliminate the
need to use latex masking on the solder side of PTH boards. My problem
is that I cannot figure a way to keep the flux from weeping between the
pallet and the shielded portion of the boards. We are using a no-clean
flux in our process and this is leaving a residue on the masked areas.
The pallets are constructed of FR4/G10.
    Does anyone have any experience with a situation similar to this?
    Any help would be greatly appreciated.
                                                                Mark A.
Warycka

Manufacturing Engineer
                                                                The
Partlow-West Company
                                                                 New
Hartford,NY

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