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March 1998

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Subject:
Re: Corrosion after electroless tin finish
From:
Michael Carano <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Sun, 1 Mar 1998 16:22:41 -0800
Content-Type:
text/plain
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text/plain (44 lines) 
Karl Ring wrote:
>
> hello all
>
> i have a problem with electroless tin plated boards.The cross sections show
> in tented vias under the solder mask strong corrosion of the copper barrel
> beneath excessive thin. The corrosion must be done in the tin bath.
>
> Do tented vias and electroless tin give generally problems or is it a
> special process  problem?
>
> have a nice weekend
>
> Karl
>
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> ################################################################Karl,
What thickness of tin deposit are you getting? Tin deposits of the nature
of electroless or immersion are sometimes to thin. You may be seeing the
results of poor rinsing or a porous tin deposit leading to localized
areas of corrosion.

Good luck

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