One thing that should reassure you is that once solder has been reflowed it
takes a higher temperature to reflow again. Check with your solder paste
supplier for actual second reflow temps.
Brian Stumm
ETS, LLC
509-483-0900 (voice)
[log in to unmask] (e-mail)
>I have a board with a 208 pin QFP top side. During the wave process the
>QFP lead at its solder joint reaches 178 degrees C. Eutectic solder
>reflows at 183 degrees C so the joints should not be reaching molten state
>and visual observation at least confirms that. What is an acceptable high
>end temperature for these joints to see before the joint is degraded to the
>point of being a reliability risk? Are there any empiracle tests that can
>be used to determine the degradation of the joint if any is taking place?
>
>Jim Gryga
>
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