Charles, I am Bert Ohlig, co-founder of OLEC Corporation.

The combination of fine line and photodielectric exposure provide an
interesting challenge. Dry films require little exposure energy. Most of
the photodielectrics require greater dosage in order to deliver their long
term characteristics.

We have exposure systems that provide an ideal blend of resolution,
productivity and economy. Our systems are available in three different
wattages (each with three intensities), three different cooling
configurations, and configured for single and double sided applications. We
also have a variety of non-conventional exposure systems that may be
suitable for your prototyping applications.

If you are interested I can e-mail you some SEM images of lines from 25 to
60 microns (1 - 2.4 mils).

If you would like to be contacted or would like additional information
please e-mail me at:
[log in to unmask]

Bert Ohlig
        714 930 2500

On Wednesday, March 18, 1998 12:55 PM, Charles Busa [SMTP:[log in to unmask]]
wrote:
> We are setting up a R & D facility which will be involved in
> MCM-L fabrication and chip scale packaging techniques. Our
> immediate concern is an Exposure unit capable of doing
> .003" lines/spaces in resists .001 - .0015" thk., and also
> capable of exposing .004" dia. vias in a photodefined dielectric.
>     I would appreciate any recommendations regarding equipment
> specifications and processing tips.
>
>     NOTE: Speed of processing is not a requirement and I would
>           like to stay away from the high power(7/8 kw) units
>           that require chillers or some additional cooling scheme.
>
>                Thank you for your consideration and time
>
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