Arlene :
1
Get yourself a copy of IPC-SM-785 , read through it , if that is what
you're after ; THAN :
2
You need a fast environmental chamber cycler ( 10'C per min. would help
)
3
You need a very specific Event Detector > Analysis Tech's 256STD model (
without Werner I would not find it either ) .
contact Craig Desrosier at ; [log in to unmask] ;
mention a rig for ResMed , you'd need the same ; get teflon cables,
standard PVC is on limit at 100"C .
4
design yourself a test vehicle (board with a selection of most "risk
prone" component types , this are usually the biggest , or ceramics [on
FR4] , etc. ) ; according to 785 instructions , = from dummy (shorted =
Topline) components .
Mind you ; as Werner also pointed out in one of his mails ; apart from
joint reliability it is MOST testing on design of the packaging ( pads
geometry, etc. ) You could say right design with right process team up
under this test , useless on their own .
5
Wire the (32) vehicles and set for the applicable test period to your
category of the product [ Table 2, page 20 ] .
It may take you from a month up to half year+ , pending speed of chamber
and your category .
6
Cycling temperature sets are listed in 785
7
For results on gold you have to work bit harder (process) than on tin ,
or organic copper, or silver (organic too),
but it does have many advantages over the rest , as the
electromechanical integrity of the application is very versatile .
Let us know how you go
The guru on this 785 is Werner Engelmaier ; [log in to unmask] ; who
designed this particular IPC reliability test .
Or Jack could help you as well if you get stuck, Werner seems to be on
road somewhere .
See you Arlene paul
>----------
>From: Arlene Infante[SMTP:[log in to unmask]]
>Sent: Thursday, 19 March 1998 1:01
>To: [log in to unmask]
>Subject: Re: [TN] Immersion Gold -Reply
>
>Yes Paul, any information about this test would help.
>
>>>> Paul Klasek <[log in to unmask]> 03/17/98 08:40pm >>>
>Arlene , a lot us ; guys from HP likely most ;
>but you are a bit laconic to be able to answer .
>a) of what ?
>b) thermal cycling on accelerated test ?
>c) to what standard ?
>We do here IPC-SM-785 , on flash gold .
>Let us know .
>Thanks
>
>Paul Klasek ; ResMed
>
>>----------
>>From: Arlene Infante[SMTP:[log in to unmask]]
>>Sent: Wednesday, 18 March 1998 9:38
>>To: [log in to unmask]
>>Subject: [TN] Immersion Gold
>>
>>Does anyone has an experience/idea on PCB Reliability testing with
>>Immersion Gold Surface finished?
>>
>>a) Temperature?
>>b) How long on Thermotron chambers?
>>c) What is the result?
>>
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