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March 1998

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Subject:
tenting vias
From:
Ron Payne <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 18 Mar 1998 07:58:45 -0800
Content-Type:
text/plain
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text/plain (20 lines) 
We have 0.016 vias and are considering tenting vias both sides with
soldermask. What is the recommended method for doing this and getting
complete tenting without breaks or bulging out?

We do not want dry film on the entire board.

Thanks......Ron

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