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March 1998

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Subject:
From:
Paul Terranova <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 18 Mar 1998 10:10:48 -0500
Content-Type:
text/plain
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text/plain (85 lines)
Jan,

Is there really a Chipnet? How can those of us interested subscribe to
this forum? I've been looking for other forums similar to Technet
related to the microelectronics industry. If anyone else has any other
good recommendations, please let me know.  Thanks.

Paul Terranova
Analytical and Environmental Test Services Lab
Worldwide Module Components Group

 Digital Equipment Corp
 200 Forest Street
 Mail Stop: MRO3-1/D2
 Marlboro,  MA  01752-3085

'    Phone: (508)467-3109
* Fax: (508)467-6796
* Email: [log in to unmask]

        -----Original Message-----
        From:   Jan Vercammen [SMTP:[log in to unmask]]
        Sent:   Monday, March 16, 1998 9:16 AM
        To:     [log in to unmask]
        Subject:        [TN] leadframe materials

        hello,

        I have a few questions concerning package leadframe materials of
integrated
        circuit packages. I have subscrided only recently to ChipNet and
I will
        submit the same questions there. However, some of the
subscribers on TechNet
        may have valuable info on the subject.

        -1- are non-copper materials (e.g.Invar, Kovar or Alloy-42 which
are Fe-Ni
            alloys) still used alot for leadframe design of surface
mount devices?
            What is the percentage of copper leadframes on the market
today?
        -2- is there a finish used for copper leadframes and, if so,
what materials
            are used and what is the covered thickness?
        -3- who has information on or can list references or literature
on the complex
            permeability of non-copper leadframe materials ( (e.g.Invar,
Kovar or
            Alloy-42)

        All help, however small is appreciated.


        regards,

        Jan Vercammen

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